Technology
ASML and TSMC plot a bigger canvas for building AI chips together as advanced node demand stretches
ASML, TSMC and other chipmaking heavyweights are deepening collaboration on the lithography, packaging and reference design that will underpin the next generation of AI accelerators, according to a Sunday report. The work spans extreme ultraviolet scanner deployment, CoWoS-S advanced packaging capacity and high-bandwidth memory stacking, with both companies positioning themselves for sustained AI buildouts through 2027. Morgan Stanley has estimated Google could produce more than 5 million TPU chips next year on TSMC's N3P process, while Microsoft is negotiating for more than 300,000 Maia 300.