Technology
SK Hynix ships 16-layer HBM4 for Nvidia Vera Rubin platform
SK Hynix has begun mass-producing a 48-gigabyte, 16-layer HBM4 device for Nvidia's Vera Rubin platform, one step beyond the 12-layer part and ahead of Samsung and Micron. Silicon Analysts' tracker said the move is the sharpest signal of the week, with the 16-layer stack offering 33 percent more capacity per memory placement than the 12-layer version. Micron's HBM3E 12-layer product cleared Nvidia qualification during the week ended 14 September while its HBM4 12-layer stack is in final qualification, and TSMC's CoWoS lead times have stretched to 52 to 78 weeks.