Technology
Compute's two bottlenecks: logic is booked, memory and packaging are tight
Two constraints defined the week in silicon. TSMC's third-quarter revenue rose 51% to about $48.4bn, and its leading-edge capacity is reported booked into 2028 with early 2-nanometre wafers near $30,000. Memory is the harder problem: DRAM and NAND contract prices are still climbing, HBM4 output is largely spoken for, and Samsung is trading HBM4 access for a shot at AMD's foundry business. GlobalFoundries agreed to build the first US silicon-interposer line for TSMC's CoWoS packaging, with volume only from 2028; ASML added a 10% parts increase from January.