Technology
TSMC weighs making 3D DRAM at Nvidia's request
TSMC has begun drafting plans to produce 3D DRAM, an advanced memory that stacks cells vertically, after a request from Nvidia, The Information reported. The chipmaker is weighing new factories against buying an existing plant and converting it, and the effort is led by advanced-packaging vice president Hsu Kuo-chin. No production date has been given. A move into memory would put TSMC in direct competition with Samsung, SK Hynix and Micron.