Technology
GlobalFoundries to build the first US silicon-interposer line for TSMC packaging
GlobalFoundries and TSMC announced a multi-year agreement on 8 October under which GlobalFoundries will make silicon interposers for TSMC's CoWoS advanced-packaging ecosystem at its Malta, New York fab, a deal reported at about $2bn. Interposers are the substrates that sit beneath compute dies and memory in AI accelerators, and the partners say the arrangement creates the first US-based supply of them. Volume production is not expected to begin ramping before the first half of 2028; the initial term runs five years.